Micro/Nanofabrication and Facilities › Coupling and Packaging

Coupling and Packaging

Objectives

The NTC has established a new Coupling and Packaging area.

The main aim of the area is the development of innovative packaging technologies to reduce manufacturing costs for research and industry for optoelectronics, MEMS, MOEMS, sensors, and LED/OLED components.

The area also focus on packaging design and engineering, using software for thermal and mechanical simulations.

The equipment line cover all the main packaging technologies, starting from the dicing of the wafer up to the hermetic sealing of the packaged product.

Here is a brief summary:

  • Dicing (Wafer, Components)
  • Wire Bonding (Ball, Wedge Deep Access, Stud Bumpings)
  • Die-attachment
  • Flip-Chip
  • Active and passive alignment
  • Hybrid integration and Assembly
  • Cleaning
  • Splicing
  • Hermetic Sealing

The area also has equipment for testing the quality and reliability of the developed processes and products (including pull and shear equipment, thermal, and humidity chambers, inspection, and vision equipment).