Assembly and Packaging Laboratory

Facts and Objectives

The Assembly and Packaging Laboratory was realized during years 2009-2010 and it started its activity in September 2010. It is an area of 80 square meters class 1000 with a little internal chamber of class 100.

Logo

Packaging Lab photo

The main aim of the Assembly and Packaging Laboratory is the development of back-end and packaging technologies for components in the field of photonics, optoelectronics, mems, moems, sensors and LED/OLED that can apply in the investigation, prototipation and packaging engineering in areas as telecom, datacom, biotecnology, ambient, microelectronics and space applications.

The Lab also focuses on package design utilizing softwares including optical, thermal and mechanical simulations (AutoCad, Comsol, Zemax).

On the other hand, we also carry out reliability test as for MILSTD and JEDEC standards.