Assembly and Packaging Laboratory

Projects

R & D with companies

2014
  • Concepción, Diseño y fabricación de componentes y subsistemas basados en fotónica integrada en Silicio para aplicaciones de interconexiones de altas prestaciones en centros de datos de nueva generación (DATAPHONE)
  • ELITAL: Filter die-attached on a board developing bumping and soldering techniques
  • V-TEC: Assembly and pigtailing technology development
  • STMicroelectronics (France)
2013
  • Development of silicon photonic packaging processes to manufacutre STM test vehicle packaged devices, STMicroelectronics (Italy)
  • CALIOPA – HUAWEI: Technological support services to flip-chip process development

International projects

2014
2013
  • BIOsensors for point detection based on nanostructured opTical components for quick deploYment in an overall CBRN EuroPEan operational capability (BIOTYPE)
2012
2010
2009

National projects

2013