Assembly and Packaging Laboratory

People

Giovani Battista Preve Foto
Position at NTC Line coordinator
Research area Micro/Nanofabrication & Facilities
Research line Assembly and Packaging Laboratory
Email gpreve @ ntc.upv.es
Telephone +34 96 387 70 00 (Ext. 88117)
Fax +34 96 387 78 27 (Ext. 77827)
Address Centro de Tecnologia Nanofotónica de Valencia
Universitat Politècnica de València
Edificio 8F, 2a Planta
Camino de Vera, s/n
46022 Valencia
Giovan Battista Preve has 20 years of experience working on packaging-related industrial R&D and production in Italy, including two years in Telettra (now Alcatel) on high-RF components, 6 years in Italtel on optoelectronic components, including a couple of years at At&t Bell Labs in Murray Hill (USA) during a technology transfer between such companies, 3 years at Gefran Sensors on MEMS activities and finally 7 years in Pirelli Labs again on optoelectronic components, as supervisor of the Back End Laboratories. In June 2008 he joined NTC as Assembly and Packaging Area Manager.
Nuria Sánchez Losilla Foto
Position at NTC Development Engineer
Research area Micro/Nanofabrication & Facilities
Research line Assembly and Packaging Laboratory
Email nsanchez @ ntc.upv.es
Telephone +34 96 387 70 00 (Ext. 88104)
Fax +34 96 387 78 27 (Ext. 77827)
Address Centro de Tecnologia Nanofotónica de Valencia
Universitat Politècnica de València
Edificio 8F, 1a Planta
Camino de Vera, s/n
46022 Valencia
Nuria Sánchez Losilla obtains the Bachelor of Science in Physics by University of Córdoba (2004) and the PhD in Physics (2010) by Universidad Autónoma de Madrid (UAM). After working on the development of nanolithography techniques based on electrochemical reactions during her PhD studies at the Microelectronics Institute of Madrid (IMM-CSIC), she joined Nanophotonics Center of Valencia (UPVL-NTC)) as a process engineer in a cleanroom environment where is responsible of technology development and manufacturing activities at wafer level of photonic devices based on silicon photonics. Recently she begun to join the Assembly and Packaging Laboratory as responsible for developing, testing and optimizing flip chip bonding processes as well as machine capability improvements. She also participate in developing and executing R&D plans for new packaging design and ideas.
Rubén Ortuño Foto
Position at NTC Development Engineer
Research area Micro/Nanofabrication & Facilities
Research line Assembly and Packaging Laboratory
Email ruormo @ ntc.upv.es
Telephone +34 96 387 97 46
Fax +34 96 387 78 27 (Ext. 77827)
Address Centro de Tecnologia Nanofotónica de Valencia
Universitat Politècnica de València
Edificio 8F, 1a Planta
Camino de Vera, s/n
46022 Valencia
Rubén Ortuño received the Engineering Master’s Degree M.Sc. and Ph.D. in Telecommunications Engineering from the Universidad Politécnica de Valencia, Spain, in 2007 and 2012, respectively. From April 2006 to July 2012, he worked as a research fellow at the Valencia Nanophotonics Technology Center (NTC) developing plasmonic metamaterial devices. In August 2012, he joined the Millimeter Wave, Terahertz and Plasmonics Laboratory at Universidad Pública de Navarra. From June 2014, he is working as a Post-doctoral researcher at the NTC. His research interest include frequency selective surfaces based on extraordinary transmission, nanoantennas, metamaterials and plasmonics. Additionally, he is also engaged in Fiber Pigtailing inside the Assembly and Packaging Laboratory.
José Ángel Ayúcar Ruiz Foto
Position at NTC Technical Staff
Research area Micro/Nanofabrication and Packaging
Research line Micro/Nanofabrication
Email jayucar @ ntc.upv.es
Telephone +34 96 387 70 00 (Ext. 88103)
Fax +34 96 387 78 27 (Ext. 77827)
Address Centro de Tecnologia Nanofotónica de Valencia
Universitat Politècnica de València
Edificio 8F, 1a Planta
Camino de Vera, s/n
46022 Valencia
José Ángel Ayúcar Ruiz has 14 years of experience working on microelectronic, in AT&T and Lucent Technologies in Madrid, as a technical specialist in the analysis failure of chips and packages, in the final product and manufacturing process, improving the yield of the wafers. Since September 2004 he is working in the Nanophotonics Technology Centre of Valencia, He started working on the support to From End. He is actually working as Technical of laboratory, Packaging and Assembly area, in the development of Front-End technologies and Back-end necessary for integrating photonic components. He is mainly specialized in Wire Bonder, FineTech, Shear, Cutting Processes and others.